Customer satisfaction is of utmost importance to SCT. To ensure that customer issues are resolved promptly, please contact the corresponding personnel at SCT as follows:

SCT Analysis Recommended Steps:

Visual Inspection: Confirm whether the chip has any burn marks, encapsulation cracks, or damage; check if the soldering is normal, if there are any solder bridges, if there are any bent legs or abnormal colors.

X-ray Inspection: Confirm if there are any solder bridges, wire bonding shorts, etc.

Electrical Testing:

Refine the failure phenomenon to the chip level and identify which pin shows an abnormal signal,

Check if the chip power supply is normal, and whether the input signals of the related failed pins are normal.

Test whether the impedance of the related failed pins and power supply pins is normal? (After desoldering the chip, it needs to be confirmed again on an individual basis)

Cross-verification (ABA):

Desolder the suspected chip and solder it onto a known good module to confirm if the same failure mode reoccurs.

Solder a known good chip onto the failed module to confirm if it can work normally.